VoxelMatters

Heidelberg Materials brings 3D printed concrete to Milan Design Week 2026

Discover the innovative Heidelberg Materials installation at Milan Design Week, showcasing intricate 3D printed concrete ...
Electronic Design

Hi-Rel 600-V SiC Power Modules Come in Multiple Configurations

Microchip Technology introduced its BZPACK mSiC power module family at the recent APEC 2026. The series was designed to meet ...
IEEE

Design of a Pulse-Operated, Nonlinear Distortion Statistics CMOS Module for Millimeter-Wave Power Amplifiers’ Adaptive Linearization

Abstract: A low-power, pulse-operation-based nonlinear distortion statistics module is proposed, comprising a nonlinear distortion error conversion unit and a ...
IEEE

Design and Evaluation of a Q-Band 4-Element DBF Antenna as Part of Direct Digital RF Transmitter Antenna Modules for On-Board SATCOM Systems

Abstract: This paper presents the design, fabrication, and evaluation of a circularly polarized Q-band 4×1 digital beam-forming (DBF) array antenna for SATCOM applications. Single beam forming and ...
Electronic Design

From COM to SMARC to OSM: The Evolution of Embedded Computing Modules

The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit. Have embedded developers ever had such a ...