Ansys (ANSS) electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications / Key Highlights Ansys collaboration to expand ...

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Ansys partnered Supermicro and Nvidia to deliver turnkey hardware, ...

Latest release fuels collaboration and digital transformation by connecting workflows, integrating AI, and optimizing complex design tasks / Key Highlights Unified Ansys technology reduces the need ...

application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys' physics solver results through real-time visualization. Ansys is ushering in the next generation of ...

Ansys (ANSS) artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasks ...

H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform – including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC – to engineer a state-of-the-art network processor chip featuring ...

Modern Ansys Design Language elevates the user experience (UX) to create a new user interface (UI) paradigm across the Ansys multiphysics portfolio and increases accessibility Native Ansys software ...

Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...

PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology, which uses ...