Abstract: A controversial part of the state-of-the-art in deep learning applied to medical imaging concerns the selection of 2D, 2.5D or 3D representations. This study contributes by contrasting the ...
Abstract: Chip-on-wafer-on-substrate (CoWoS®) is an advanced packaging technology to make high performance computing (HPC) and artificial intelligence (AI) components. As a high-end system-in-package ...
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