Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.
Abstract: Recent advancements in Transformer-based human mesh reconstruction (HMR) are commendable. However, these models often lift 2D images directly to 3D vertices without explicit intermediate ...
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