The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the demand for higher performance in increasingly compact form factors [1]. Over ...
Abstract: To address the challenge of large-scale packing problems, this paper proposes a novel hierarchical algorithm based on the geometrical classification of parts. The algorithm begins by ...
Abstract: The rapid advancement of Urban Air Mobility (UAM) introduces dual challenges for aerial vehicles, encompassing spectrum resource competition and air security threats. To address spectrum ...
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