VoxelMatters

Heidelberg Materials brings 3D printed concrete to Milan Design Week 2026

Discover the innovative Heidelberg Materials installation at Milan Design Week, showcasing intricate 3D printed concrete ...
Electronic Design

Hi-Rel 600-V SiC Power Modules Come in Multiple Configurations

Microchip Technology introduced its BZPACK mSiC power module family at the recent APEC 2026. The series was designed to meet ...
IEEE

Design and Evaluation of a 650 V, 300 A GaN-Based Power Module with Integrated Drivers and Ultra-Low Inductance Layout

Abstract: Gallium Nitride (GaN) devices offer high switching speed, low loss, and compact design. To fully exploit these advantages, packaging is critical. In this paper, a 650 V/ 300 A half bridge ...
IEEE

Design of a Pulse-Operated, Nonlinear Distortion Statistics CMOS Module for Millimeter-Wave Power Amplifiers’ Adaptive Linearization

Abstract: A low-power, pulse-operation-based nonlinear distortion statistics module is proposed, comprising a nonlinear distortion error conversion unit and a ...
Electronic Design

From COM to SMARC to OSM: The Evolution of Embedded Computing Modules

The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit. Have embedded developers ever had such a ...