Learn about Creality's impact on engineering education by promoting active learning through hands-on 3D printing projects.
Abstract: Through silicon via (TSV) technology has been widely employed as a promising 3-D packaging technology to achieve significant reduction in device dimensions. Due to the existence of ...
The Clark Art Institute's contemporary art exhibition "Sónia Almeida: Stages" is on view now for free at the museum, ...
Abstract: This article focuses on the electromagnetic-thermal coupled design and optimization of a yokeless and segmented armature (YASA) Halbach-array axial flux permanent magnet (AFPM) machine for ...