Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

The micro/nano metal pattern formation is a key step in the assembly of various devices. However, ex situ approaches of metal patterning limited their industrial applications due to the poor stability ...

Stripes, curved fibres, dot arrays and some exotic stripe-dot hybrids on the surface of a frozen liquid metal. (Courtesy: K Kalantar-Zadeh) Highly ordered nanopatterns spontaneously form on the ...

Holes, patterns, and cutouts occur frequently in sheet metal parts and their creation is crucial to modeling these parts. "SolidWorks for the Sheet Metal Guy - Course 2: Hole Patterns and Notches” ...