Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
Combining six fast-recovery MOSFETs and three half-bridge HVICs in a 29 x 12-mm Tiny-DIP package, a group of 500-V Motion-Smart Power Modules target low-power (below-100-W) brushless dc motor ...
On November 27th, Trina Solar, Risen Energy, Zhonghuan Semiconductor, Tongwei, Huansheng Photovoltaic, Runyang New Energy Technology, Canadian Solar and Wuxi Shangji Automation jointly proposed ...
Why board-level standardization of FPGA implementations matter. What the Harmonized FPGA Module (HFM) standard entails. How semiconductor manufacturers, embedded module manufacturers, VARs, system ...
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