NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

AND's ConnectZED rf modules are designed for use with embedded applications requiring low data rates and low power consumption. The Dual Profile variant is targeted at applications which require a ...

GREENSBORO, N.C.--(BUSINESS WIRE)--Guerrilla RF, Inc. (OTCQX: GUER) today announced that its high-efficiency GRF5509 4-watt power amplifier was selected by Impinj (NASDAQ: PI) for use in their ...

MIGDAL HAEMEK, Israel, Sept 10, 2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the production of Wi-Fi 7 RF front-end ...

POWAY, Calif.--(BUSINESS WIRE)--Cohu, Inc. (NASDAQ: COHU), a global leader in back-end semiconductor equipment and services, today announced the introduction of its RedDragon RF test module for 5G, Wi ...

Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...

Circuits Integrated Hellas (CIH), a company specialising in satellite communication technology, has introduced a new family of compact Ka-band power amplifier modules that combine amplification and ...

Next-generation RF to millimeter-wave silicon MMIC and module product development software Cadence is excited to announce the launch of its latest RF design and analysis platform, Virtuoso Studio RF.

Our intensity and phase modulators operate from low frequencies up to 40Gbps/40GHz and for a broad range of wavelength windows including 800nm, 1060nm, 1300nm, 1550nm and 2 microns. Matched with the ...

Module technology, including system-in-a-package (SiP) and multi-chip modules (MCMs), is creating attractive alternatives to the system-on-a-chip (SoC) design methodology for systems that require ...