Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...

The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is ...

I keep reading these references to Doom 1 and other 'first generation first-person shotters' as being "2.5D" To me this somehow implies they are 3-D perspective, but not quite up to today's "true 3-D" ...